SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve problems that manufacturing of a back side illuminated (BSI) image sensor requires many complicated processes and processing.;SOLUTION: A semiconductor device 100 includes: a semiconductor substrate 101 including a first side 101a and a second side 101b opposite to the first side; a radiation sensing element 101c disposed on the semiconductor substrate; an interlayer dielectric (ILD) 102 disposed over the first side of the semiconductor substrate; and a conductive pad 103 disposed in the semiconductor substrate, passing through the ILD, and configured to couple to an interconnect structure disposed on the ILD. A portion of the conductive pad is surrounded by the semiconductor substrate, and step height is formed by a surface of the portion of the conductive pad and the second side of the semiconductor substrate.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT