CIRCUIT BOARD ASSEMBLY, ELECTRONIC DEVICE ASSEMBLY, MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board assembly and an electronic device assembly effective for suppressing scratches in circuit metal plate, and to provide manufacturing methods therefor.;SOLUTION: A circuit board assembly 20 includes an insulating mother board 1 having a circuit board region 1a and a dummy region 1b surrounding the circuit board region 1a, and having an upper surface including the boundary of circuit board region 1a, a metal circuit board 3 joined to the upper surface of the insulating mother board 1 via a brazing filler metal 2 in the circuit board region 1a, and a dummy metal plate 4 joined to the upper surface of the insulating mother board 1 via the brazing filler metal 2 in the dummy region 1b. Position of the upper surface of the dummy metal plate 4 is higher than the position of the upper surface of the metal circuit board 3.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT