FLAT PLATE JIG, RESIN MOLDING DEVICE AND RESIN MOLDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a flat plate jig for molding a rein for protecting an electronic component arranged on a wafer and a substrate, having a simple structure, without using a release film, a resin molding device and a resin molding method.;SOLUTION: There is provided a flat plate jig having a surrounding part 12 for surrounding space on an upper surface with adhering to the upper surface so that a space 28 to which a resin for molding 30 is supplied is formed on the upper surface 22 of a wafer or a substrate 20, and a circumferential part 14 extending along an outer peripheral of the wafer or the substrate from the surrounding part and defining a position of the surrounding part to the wafer or the substrate, a thermoplastic plastic is molded, the resin for molding is supplied to a space surrounded by the upper surface of the wafer and the substrate and an inner peripheral side surface of the surrounding part, a lower surface 24 of the wader or the substrate and the surrounding part is pressed and the upper mold, the surrounding part and the wafer or the substrate are adhered and leakage of a resin for molding 0 is inhibited when the resin for molding is compressed by the upper old 40 and a lower mold 50.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT