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Method of setting evaluation standard of semiconductor wafer, method of evaluating semiconductor wafer, method of evaluating semiconductor wafer manufacturing process, and method of manufacturing semiconductor wafer

机译:设定半导体晶片的评价基准的方法,半导体晶片的评价方法,半导体晶片的制造工序的评价方法以及半导体晶片的制造方法

摘要

The method of setting the evaluation standard of a semiconductor wafer includes setting the A and B on the basis of an abnormal substances overlooking rate “a” specific to the light-scattering type surface inspection apparatus specified by an apparatus-induced abnormal substances overlooking rate Φ due to the light-scattering type surface inspection apparatus and a probabilistic abnormal substances overlooking rate, in which A is the number of times of inspection, B is an abnormal substances detection threshold, the apparatus-induced abnormal substances overlooking rate Φ is higher as the target abnormal substances size to be detected is smaller, and the probabilistic abnormal substances overlooking rate is lower as the number of times of inspection increases.
机译:设定半导体晶片的评价标准的方法包括:基于由设备引起的异常物质忽略率Φ指定的特定于光散射型表面检查设备的异常物质忽略率“ a”来设定A和B。由于光散射型表面检查设备和概率异常物质忽略率,其中A是检查次数,B是异常物质检测阈值,因此,设备引起的异常物质忽略率Φ越高,随着检查次数的增加,要检测的目标异常物质的尺寸较小,概率异常物质的漏检率降低。

著录项

  • 公开/公告号JP6350637B2

    专利类型

  • 公开/公告日2018-07-04

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20160222479

  • 发明设计人 長澤 崇裕;高梨 啓一;

    申请日2016-11-15

  • 分类号H01L21/66;G01N21/956;

  • 国家 JP

  • 入库时间 2022-08-21 13:07:52

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