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Method of setting evaluation standard of semiconductor wafer, method of evaluating semiconductor wafer, method of evaluating semiconductor wafer manufacturing process, and method of manufacturing semiconductor wafer
Method of setting evaluation standard of semiconductor wafer, method of evaluating semiconductor wafer, method of evaluating semiconductor wafer manufacturing process, and method of manufacturing semiconductor wafer
The method of setting the evaluation standard of a semiconductor wafer includes setting the A and B on the basis of an abnormal substances overlooking rate “a” specific to the light-scattering type surface inspection apparatus specified by an apparatus-induced abnormal substances overlooking rate Φ due to the light-scattering type surface inspection apparatus and a probabilistic abnormal substances overlooking rate, in which A is the number of times of inspection, B is an abnormal substances detection threshold, the apparatus-induced abnormal substances overlooking rate Φ is higher as the target abnormal substances size to be detected is smaller, and the probabilistic abnormal substances overlooking rate is lower as the number of times of inspection increases.
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