The method of setting the evaluation standard of a semiconductor wafer includes setting the A and B on the basis of an abnormal substances overlooking rate “a” specific to the light-scattering type surface inspection apparatus specified by an apparatus-induced abnormal substances overlooking rate Φ due to the light-scattering type surface inspection apparatus and a probabilistic abnormal substances overlooking rate, in which A is the number of times of inspection, B is an abnormal substances detection threshold, the apparatus-induced abnormal substances overlooking rate Φ is higher as the target abnormal substances size to be detected is smaller, and the probabilistic abnormal substances overlooking rate is lower as the number of times of inspection increases.
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