Copper foil with carrier, laminate, process for producing laminate, process for producing printed wiring board, and process for producing electronic device

摘要

The present invention provides a copper foil with a carrier including an ultra-thin copper layer having a thickness of 0.9 μm or less and capable of preferably preventing generation of pin holes during peeling of the carrier. A copper foil with a carrier including a carrier, an intermediate layer, and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer has a thickness of 0.9 μm or less, and the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 10 N/m or less.