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System and method for forming a buried lower electrode associated with a hermetically sealed MEMS device

机译:用于形成与气密MEMS装置相关的掩埋下部电极的系统和方法

摘要

A system and method for forming a sensor device with a buried first electrode includes providing a first silicon portion with an electrode layer and a second silicon portion with a device layer. The first silicon portion and the second silicon portion are adjoined along a common oxide layer formed on the electrode layer of the first silicon portion and the device layer of the second silicon portion. The resulting multi-silicon stack includes a buried lower electrode that is further defined by a buried oxide layer, a highly-doped ion implanted region, or a combination thereof. The multi-silicon stack has a plurality of silicon layers and silicon dioxide layers with electrically isolated regions in each layer allowing for both the lower electrode and an upper electrode. The multi-silicon stack further includes a spacer that enables the lower electrode to be accessible from a topside of the sensor device.
机译:一种用于形成具有掩埋的第一电极的传感器装置的系统和方法,包括为第一硅部分提供电极层和第二硅部分提供器件层。沿着形成在第一硅部分的电极层和第二硅部分的器件层上的公共氧化物层邻接第一硅部分和第二硅部分。所得的多晶硅叠层包括由下部掩埋电极,其进一步由掩埋氧化物层,高掺杂离子注入区或它们的组合限定。多晶硅叠层具有多个硅层和二氧化硅层,在每个层中具有电隔离区域,从而允许下部电极和上部电极。多晶硅堆叠还包括隔离物,该隔离物使下部电极能够从传感器装置的顶侧接近。

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