首页> 外国专利> Displacement inhibitor for electrolytic hard gold plating solution and electrolytic hard gold plating solution containing the same

Displacement inhibitor for electrolytic hard gold plating solution and electrolytic hard gold plating solution containing the same

机译:电解硬质镀金溶液的位移抑制剂和包含该抑制剂的电解硬质镀金溶液

摘要

According to the present invention, it contains at least one compound selected from the group consisting of an imidazole compound having a mercapto group, a triazole compound having a mercapto group, and an aliphatic compound having a sulfonic acid group and a mercapto group. An anti-replacement agent for electrolytic hard gold plating solution is provided. Further, this anti-replacement agent for electrolytic hard gold plating solution, a gold salt, a soluble cobalt salt and / or a soluble nickel salt, an organic acid conductive salt, An electrolytic hard gold plating solution containing a chelating agent is provided.
机译:根据本发明,其包含选自具有巯基的咪唑化合物,具有巯基的三唑化合物和具有磺酸基和巯基的脂族化合物中的至少一种化合物。提供了一种用于电解镀硬金溶液的防置换剂。另外,提供该电解硬金电镀液用防置换剂,金盐,可溶性钴盐和/或可溶性镍盐,有机酸导电盐,以及含有螯合剂的电解硬金电镀液。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号