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Displacement inhibitor for electrolytic hard gold plating solution and electrolytic hard gold plating solution containing the same
Displacement inhibitor for electrolytic hard gold plating solution and electrolytic hard gold plating solution containing the same
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机译:电解硬质镀金溶液的位移抑制剂和包含该抑制剂的电解硬质镀金溶液
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摘要
According to the present invention, it contains at least one compound selected from the group consisting of an imidazole compound having a mercapto group, a triazole compound having a mercapto group, and an aliphatic compound having a sulfonic acid group and a mercapto group. An anti-replacement agent for electrolytic hard gold plating solution is provided. Further, this anti-replacement agent for electrolytic hard gold plating solution, a gold salt, a soluble cobalt salt and / or a soluble nickel salt, an organic acid conductive salt, An electrolytic hard gold plating solution containing a chelating agent is provided.
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