Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same

摘要

Electrolytic hard gold plating solution substitution inhibitors containing at least one compound selected from the group consisting of an imidazole compound having a mercapto group, a triazole compound having a mercapto group, and an aliphatic compound having a sulfonic acid group and a mercapto group are provided. Electrolytic hard gold plating solutions containing at least one electrolytic hard gold plating solution substitution inhibitor, a gold salt, a soluble cobalt salt and/or a soluble nickel salt, an organic acid conducting salt, and a chelating agent are also provided.