Provided is a writing pressure detection module capable of easily ensuring the assembly accuracy of components and maintaining the connection strength with a printed circuit board against application of a large writing pressure. A pressure-sensitive part that outputs electrical information corresponding to the detected pressure through the electrode, and a pressure applied based on the held pressure-sensitive part and the electrical information output from the pressure-sensitive part while holding the pressure-sensitive part And a holder for electrically connecting a circuit board having a circuit for detecting the above. The holder includes a holding portion that holds the pressure-sensitive portion and an engaging portion with the circuit board, and wiring extending from the holding portion to the engaging portion is formed on the surface of the holder. And the electrode of the pressure-sensitive part and the circuit board are electrically connected via wiring.
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