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Three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes
Three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes
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机译:裸片尺寸不相等的异质晶圆的三维晶圆级集成
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摘要
A method is provided for three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes that include a first wafer and a second wafer. The method includes selecting a periodicity for the second wafer to be manufactured that matches the periodicity of the first wafer. The method further includes manufacturing the second wafer in accordance with the selected periodicity. The method also includes placing, by a laser-based patterning device, a pattern in spaces between dies of the second wafer. The method additionally includes stacking the first wafer onto the second wafer, using a copper-to-copper bonding process to bond the first wafer to the second wafer.
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