首页> 外国专利> Method for compensating for temperature effects in semiconductor device structures using a diode structure and a tunable resistor

Method for compensating for temperature effects in semiconductor device structures using a diode structure and a tunable resistor

机译:使用二极管结构和可调电阻补偿半导体器件结构中温度影响的方法

摘要

A method includes providing a semiconductor device structure including a substrate having a semiconductor-on-insulator (SOI) region and a hybrid region. A semiconductor device is provided in the SOI region. The semiconductor device includes a gate structure, a diode structure provided in the hybrid region and coupled to a substrate material of the SOI region, a supply circuit arrangement including first and second supply lines, a first resistor coupled between the first supply line and a first terminal of the diode structure, and a second resistor coupled between the second supply line and the substrate material positioned beneath the gate structure. At least one of the first and second resistors comprises a tunable resistor. A resistance of the tunable resistor is adjusted so as to adjust a threshold voltage (Vt) of the semiconductor device in dependence on an operating temperature of the SOI region.
机译:一种方法包括提供半导体器件结构,该半导体器件结构包括具有绝缘体上半导体(SOI)区域和混合区域的衬底。在SOI区域中提供了半导体器件。该半导体器件包括栅极结构,设置在混合区域中并耦合到SOI区域的衬底材料的二极管结构,包括第一和第二供电线的供电电路装置,耦合在第一供电线和第一供电线之间的第一电阻器。二极管结构的第二端和连接在第二电源线和位于栅极结构下方的衬底材料之间的第二电阻器。第一和第二电阻器中的至少一个包括可调电阻器。调节可调电阻器的电阻,以便根据SOI区域的工作温度来调节半导体器件的阈值电压(Vt)。

著录项

  • 公开/公告号US10026753B2

    专利类型

  • 公开/公告日2018-07-17

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201715799243

  • 发明设计人 JUERGEN FAUL;

    申请日2017-10-31

  • 分类号H01L27/12;H01L27/02;H01L23/50;

  • 国家 US

  • 入库时间 2022-08-21 13:05:42

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号