TEMPERATURE COMPENSATED MICROELECTROMECHANICAL STRUCTURES AND METHODS OF COMPENSATING EFFECTS OF AMBIENT TEMPERATURE VARIATIONS

摘要

MEMS structures are provided that com-pensate for ambient temperature changes, processvariations, and the like, and can be employed inmany applications. These structures include an ac-tive microactuator (105) adapted for thermal actu-ation to move in response to the active alterationof its temperature. The active microactuator maybe further adapted to move in response to ambi-ent temperature changes. These structures also in-clude a temperature compensation element (205),such as a temperature compensation microactua-tor or frame, adapted to move in response to am-blent temperature changes. The active microac-tuator and the temperature compensation elementmove cooperatively in response to ambient temper-ature changes. Thus, a predefined spatial relation-ship is maintained between the active microactu-ator and the associated temperatare compensationmicroactuator over a broad range of ambient tem-peratures absent active alteration of the tempera-ture of the active microactuator. In an alternativeembodiment wherein the active microactuator issuspended within a frame above the substrate, theMEMS structure holds at least a portion of the ac-tive microactuator in a fixed position relative to thesubstrate over a broad range of ambient tempera-tures absent active alteration of the temperature ofthe active microactuator.