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Silicon carbide semiconductor base, method of crystal axis alignment in silicon carbide semiconductor base, and method of manufacturing silicon carbide semiconductor device

机译:碳化硅半导体基体,碳化硅半导体基体中的晶轴对准方法以及制造碳化硅半导体器件的方法

摘要

On a first epitaxial layer of a first conductivity type or a second conductivity type provided on a front surface of a silicon carbide substrate, a mark indicating a crystal axis direction of the silicon carbide substrate within a margin of error of one degree is provided. The mark is created on the silicon carbide substrate by forming the first epitaxial layer of the first conductivity type or the second conductivity type on the front surface of the silicon carbide substrate, detecting a stacking fault from the first epitaxial layer, and confirming the crystal axis direction of the silicon carbide substrate from the detected stacking fault.
机译:在设置在碳化硅衬底的前表面上的第一导电类型或第二导电类型的第一外延层上,设置有指示碳化硅衬底的晶轴方向在一个误差范围内的标记。通过在碳化硅衬底的前表面上形成第一导电类型或第二导电类型的第一外延层,检测来自第一外延层的堆叠缺陷并确认晶轴,在碳化硅衬底上产生标记。从检测到的堆垛层错的碳化硅衬底的方向。

著录项

  • 公开/公告号US10032724B2

    专利类型

  • 公开/公告日2018-07-24

    原文格式PDF

  • 申请/专利权人 FUJI ELECTRIC CO. LTD.;

    申请/专利号US201715634656

  • 发明设计人 YASUYUKI KAWADA;TAKESHI TAWARA;

    申请日2017-06-27

  • 分类号H01L29/04;H01L29/161;H01L29/78;H01L23/544;H01L21/66;H01L21/20;H01L21/336;H01L29/66;H01L29/16;H01L21/04;H01L29/423;H01L21/02;H01L29/739;

  • 国家 US

  • 入库时间 2022-08-21 13:04:55

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