A wet wipe pad designed to be connected or attached to floor mop heads or other cleaning tool handle that utilize a hook-and-loop mechanism for attaching the wipe pad thereto. The wipe pad can be made of multi layers of material that may include a cleaning layer ultrasonically welded to an attachment layer having an absorption layer disposed between the cleaning layer and the attachment layer. Alternatively, the wipe pad can be made from a single layer of material that can attach on one side thereof to the mop head or other cleaning tool handle, which also provides a cleaning surface on the other side of the single layer of material. The wipe pad of the invention may also be constructed from two layers of material that include a cleaning layer ultrasonically welded to an attachment layer. Regardless of the number of layers used in the wipe pad of the invention, the wipe pad is configured with at least one linking ribbon or tape strip of non-looped straight-line fibers extending along the length of the attachment layer and which forms the means or mechanism for releasably securing to “hooks” disposed on the mop head. The wipe pad, including its layer(s) and the linking ribbon or tape strip is constructed of materials that are compostable and biodegradable, making it an environmentally friendly product.
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