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RESIN FILM, COVERLAY FOR PRINTED WIRING BOARD, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
RESIN FILM, COVERLAY FOR PRINTED WIRING BOARD, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
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机译:树脂膜,印刷线路板用覆盖层,印刷线路板用基材和印刷线路板
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摘要
A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.
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