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Compound semiconductor transistor and high-Q passive device single chip integration

机译:复合半导体晶体管与高Q无源器件单芯片集成

摘要

An integrated compound semiconductor circuit including a high-Q passive device may include a compound semiconductor transistor. The integrated compound semiconductor circuitry may also include a high-Q inductor device. The integrated compound semiconductor may further include a back-end-of-line interconnect layer electrically contacting the high-Q inductor device and the compound semiconductor transistor, the back-end-of-line interconnect layer comprising a gold base layer and a copper interconnect layer.
机译:包括高Q无源器件的集成化合物半导体电路可以包括化合物半导体晶体管。集成化合物半导体电路还可以包括高Q电感器器件。集成化合物半导体可以进一步包括电接触高Q电感器器件和化合物半导体晶体管的线后端互连层,该线后端互连层包括金基层和铜互连。层。

著录项

  • 公开/公告号US10062683B1

    专利类型

  • 公开/公告日2018-08-28

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号US201715587837

  • 发明设计人 BIN YANG;XIA LI;GENGMING TAO;

    申请日2017-05-05

  • 分类号H01L29/15;H01L27/06;H01L49/02;H01L29/778;H01L29/737;H01L29/20;H01L23/532;H01L23/535;H01L21/8252;H01L21/768;H01L23/66;

  • 国家 US

  • 入库时间 2022-08-21 13:02:59

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