首页> 外国专利> THREE-DIMENSIONAL MEMORY DEVICE WITH ENHANCED MECHANICAL STABILITY SEMICONDUCTOR PEDESTAL AND METHOD OF MAKING THEREOF

THREE-DIMENSIONAL MEMORY DEVICE WITH ENHANCED MECHANICAL STABILITY SEMICONDUCTOR PEDESTAL AND METHOD OF MAKING THEREOF

机译:具有增强的机械稳定性半导体基座的三维存储器及其制造方法

摘要

After formation of an alternating stack of insulating layers and sacrificial material layers, a memory opening can be formed through the alternating stack, which is subsequently filled with a columnar semiconductor pedestal portion and a memory stack structure. Breakage of the columnar semiconductor pedestal portion under mechanical stress can be avoided by growing a laterally protruding semiconductor portion by selective deposition of a semiconductor material after removal of the sacrificial material layers to form backside recesses. At least an outer portion of the laterally protruding semiconductor portion can be oxidized to form a tubular semiconductor oxide spacer. Electrically conductive layers can be formed in the backside recesses to provide word lines for a three-dimensional memory device.
机译:在形成绝缘层和牺牲材料层的交替堆叠之后,可以形成穿过交替堆叠的存储器开口,其随后被柱状半导体基座部分和存储器堆叠结构填充。在去除牺牲材料层以形成背面凹部之后,通过选择性地沉积半导体材料来生长侧向突出的半导体部分,可以避免在机械应力下柱状半导体基座部分的破裂。横向突出的半导体部分的至少外部可以被氧化以形成管状的半导体氧化物隔离物。可以在背面凹槽中形成导电层,以为三维存储器件提供字线。

著录项

  • 公开/公告号US2018197876A1

    专利类型

  • 公开/公告日2018-07-12

    原文格式PDF

  • 申请/专利权人 SANDISK TECHNOLOGIES LLC;

    申请/专利号US201715401426

  • 申请日2017-01-09

  • 分类号H01L27/11582;H01L27/1157;H01L27/11573;H01L27/11524;H01L27/11556;H01L27/11529;H01L23/522;H01L23/528;

  • 国家 US

  • 入库时间 2022-08-21 13:01:22

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