首页> 外国专利> FULLY DEPLETED SILICON-ON-INSULATOR (FDSOI) TRANSISTOR DEVICE AND SELF-ALIGNED ACTIVE AREA IN FDSOI BULK EXPOSED REGIONS

FULLY DEPLETED SILICON-ON-INSULATOR (FDSOI) TRANSISTOR DEVICE AND SELF-ALIGNED ACTIVE AREA IN FDSOI BULK EXPOSED REGIONS

机译:FDSOI散装暴露区域的绝缘硅耗尽(FDSOI)晶体管器件和自对准有源区

摘要

Methods for eliminating the distance between a BULEX and SOI and the resulting devices are disclosed. Embodiments include providing a silicon layer on a BOX layer on a silicon substrate; forming two active areas in the silicon layer, separated by a space; forming first and second polysilicon gates over one active area, a third polysilicon gate over the space, and fourth and fifth polysilicon gates over the other active area, the second and fourth gates abutting edges of the space; forming spacers at opposite sides of each gate; removing the second, third, and fourth gates and the corresponding spacers; removing the silicon layer and BOX layer in the space, forming a trench and exposing the silicon substrate; forming second spacers on sidewalls of the trench; forming raised source/drain regions on each active area; and forming a p-well contact on the silicon substrate between the second spacers.
机译:公开了消除BULEX和SOI与所得器件之间的距离的方法。实施例包括在硅衬底上的BOX层上提供硅层;以及在硅层中形成两个有源区域,由一个间隔隔开;在一个有源区上形成第一和第二多晶硅栅,在空间上形成第三多晶硅栅,在另一个有源区上形成第四和第五多晶硅栅,第二和第四栅与空间的边缘邻接;在每个栅极的相对侧形成间隔物;去除第二,第三和第四栅极以及相应的间隔物;去除空间中的硅层和BOX层,形成沟槽并暴露硅衬底。在沟槽的侧壁上形成第二隔离物。在每个有源区上形成凸起的源/漏区;在第二隔离物之间的硅衬底上形成p阱接触。

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