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Method to fabricate GaN-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layer

机译:具有硅扩散限定的电流阻挡层的基于GaN的垂直腔表面发射器件的制造方法

摘要

This invention discloses a method for the fabrication of GaN-based vertical cavity surface-emitting devices featuring a silicon-diffusion defined current blocking layer (CBL). Such devices include vertical-cavity surface-emitting laser (VCSEL) and resonant-cavity light-emitting diode (RCLED). The silicon-diffused P-type GaN region can be converted into N-type GaN and thereby attaining a current blocking effect under reverse bias. And the surface of the silicon-diffused area is flat so the thickness of subsequent optical coating is uniform across the emitting aperture. Thus, this method effectively reduces the optical-mode field diameter of the device, significantly decreases the spectral width of LED, and produces single-mode emission of VCSEL.
机译:本发明公开了一种制造具有硅扩散限定电流阻挡层(CBL)的GaN基垂直腔表面发射器件的方法。这种设备包括垂直腔表面发射激光器(VCSEL)和谐振腔发光二极管(RCLED)。可以将硅扩散的P型GaN区域转换为N型GaN,从而在反向偏置下获得电流阻挡效果。并且硅扩散区域的表面是平坦的,因此随后的光学涂层的厚度在整个发射孔上是均匀的。因此,该方法有效地减小了器件的光模场直径,显着减小了LED的光谱宽度,并产生了VCSEL的单模发射。

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