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Semiconductor devices with superlattice and punch-through stop (PTS) layers at different depths and related methods

机译:在不同深度具有超晶格和穿通停止层(PTS)的半导体器件及相关方法

摘要

A semiconductor device may include a semiconductor substrate and first transistors having a first operating voltage. Each first transistor may include a first channel and a first punch-through stop (PTS) layer in the semiconductor substrate, and the first PTS layer may be at a first depth below the first channel. The semiconductor device may further include second transistors having a second operating voltage higher than the first operating voltage. Each second transistor may include a second channel and a second PTS layer in the semiconductor substrate, and the second PTS layer may be at a second depth below the second channel that is greater than the first depth. Furthermore, the first channel may include a first superlattice, and the second channel may include a second superlattice.
机译:半导体器件可以包括半导体衬底和具有第一工作电压的第一晶体管。每个第一晶体管可以在半导体衬底中包括第一沟道和第一穿通停止(PTS)层,并且第一PTS层可以在第一沟道下方的第一深度处。半导体器件可以进一步包括第二晶体管,该第二晶体管的第二工作电压高于第一工作电压。每个第二晶体管可以在半导体衬底中包括第二沟道和第二PTS层,并且第二PTS层可以在第二沟道下方的第二深度处,该第二深度大于第一深度。此外,第一通道可以包括第一超晶格,第二通道可以包括第二超晶格。

著录项

  • 公开/公告号US9941359B2

    专利类型

  • 公开/公告日2018-04-10

    原文格式PDF

  • 申请/专利权人 ATOMERA INCORPORATED;

    申请/专利号US201615154276

  • 发明设计人 ROBERT J. MEARS;HIDEKI TAKEUCHI;

    申请日2016-05-13

  • 分类号H01L29/15;H01L27/092;H01L29/06;H01L21/8238;H01L29/66;H01L29/423;H01L21/8234;H01L29/78;H01L29/10;H01L27/088;

  • 国家 US

  • 入库时间 2022-08-21 12:54:36

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