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Device for emulating temperature of a composite structure through a thermal cure cycle

机译:通过热固化循环模拟复合结构温度的装置

摘要

A temperature emulator may include a stack assembly having a pair of end plates positioned at an uppermost and lowermost location of the stack assembly, a plurality of heat sink plates disposed between the pair of end plates, each of the heat sink plates having a plurality of heat sink cutouts, a plurality of shim plates separating adjacent pairs of the end plates and the heat sink plates, each of the shim plates having a shim cutout, an open cavity formed by a plurality of adjacent heat sink cutouts and shim cutouts, thermal insulation disposed within the cavity, and at least one temperature sensor coupled to at least one of the plurality of heat sink plates.
机译:温度仿真器可以包括:堆叠组件,其具有位于堆叠组件的最高和最低位置的一对端板;多个散热器板,其布置在该对端板之间,每个散热器板具有多个散热器切口,将相邻的端板和散热器板对隔开的多个垫片板,每个垫片板均具有垫片切口,由多个相邻的散热器切口和垫片切口形成的开孔,隔热至少一个温度传感器设置在空腔内,并且至少一个温度传感器耦合到多个散热板中的至少一个。

著录项

  • 公开/公告号US9835500B2

    专利类型

  • 公开/公告日2017-12-05

    原文格式PDF

  • 申请/专利权人 THE BOEING COMPANY;

    申请/专利号US201514718688

  • 发明设计人 KARL M. NELSON;

    申请日2015-05-21

  • 分类号G01K7/02;B29C35/02;

  • 国家 US

  • 入库时间 2022-08-21 12:54:26

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