首页> 外国专利> For point-to-point interconnection with increase Test coverage from fault injection techniques

For point-to-point interconnection with increase Test coverage from fault injection techniques

机译:用于点对点互连,并增加了故障注入技术的测试覆盖率

摘要

Various aspects describe on piece hardware error generation device assembly.In some cases, hardware error generation device assembly is connected to the data path between two components in identical chips.When fault seeding input is received, which generates device assembly and changes the data just transmitted on the data path by being inserted into the data pattern of simulation erroneous condition.Alternatively or cumulatively, which randomly changes one or more of transmitted data bit.
机译:各个方面描述了硬件错误生成设备组件,在某些情况下,硬件错误生成设备组件连接到同一芯片中两个组件之间的数据路径,当接收到故障播种输入时,将生成设备组件并更改刚刚传输的数据通过插入到模拟错误条件的数据模式中的数据路径,可以交替或累加地随机改变一个或多个传输数据位。

著录项

  • 公开/公告号BR112018005865A2

    专利类型

  • 公开/公告日2018-10-16

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号BR20181105865

  • 发明设计人 KANWAL BANGA;RAHEEL KHAN;SCOTT CHENG;

    申请日2016-09-09

  • 分类号H04L1/24;

  • 国家 BR

  • 入库时间 2022-08-21 12:53:35

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