NOVEL POLYMER COMPOSITE MATERIAL FOR EMI SHIELDING OF ELECTRONIC SYSTEM/CIRCUITS

摘要

An EMI shielding material comprising a non-conductive polymer- High density polyethylene, a conductive nano filler- Multiwalled carbon nanotube (MWCNT), an electrically conductive metal nano filler- nanonickel powder, an insulating material coated with metal powder cenosphere coated with nickel, which are blended in right proportion and molded in to desired shape, wherein, HDPE is the base matrix (75%), MWCNT (25 Plus/minus 2%) & nano-nickel (2%) are the filler material in addition to 1% of nickel coated cenosphere, 1% of PEGMA, 2ml of APTS added as additional filler.