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Alkaline solution, without cyanide, for electroplating gold alloys, a method for electroplating and a substrate comprising a shiny, corrosion-free deposit of a gold alloy
Alkaline solution, without cyanide, for electroplating gold alloys, a method for electroplating and a substrate comprising a shiny, corrosion-free deposit of a gold alloy
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机译:用于电镀金合金的不含氰化物的碱性溶液,电镀方法和包含金合金的光泽无腐蚀沉积物的基材
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摘要
Alkaline electroplating solution, without cyanide for electroplating a gold and copper alloy, comprising a) from 0.5 to 10 g / l gold ions; b) from 0 to 3 g / l of zinc, iron or indium ions; c) 70 to 200 g / l of a sulphite sa d) 0.1 to 8 g / l copper ions; e) from 0 to 75 g / l of a complexing agent that is different from hydantoin, a salt thereof or 5,5-dimethylhydantoin, characterized in that the electroplating solution further comprises 1.0 to 40 g / l of hydantoin, a salt thereof or 5,5-dimethylhydantoin, in which the sulphite salt is sodium sulphite and / or potassium sulphite.
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机译:碱性电镀液,不带氰化物,用于电镀金和铜合金,包括:a)0.5至10 g / l的金离子; b)0至3 g / l的锌,铁或铟离子; c)70至200克/升的亚硫酸盐; d)0.1至8 g / l的铜离子; e)0-75 g / l不同于乙内酰脲,其盐或5,5-二甲基乙内酰脲的络合剂,其特征在于电镀液还包含1.0-40 g / l的乙内酰脲,其盐或5,5-二甲基乙内酰脲,其中亚硫酸盐是亚硫酸钠和/或亚硫酸钾。
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