INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE EQUIPPED WITH INTERMEDIATE CONNECTOR, AND METHOD FOR MANUFACTURING INTERMEDIATE CONNECTOR

摘要

An intermediate connector (1) is provided with: an elongated flat sheet-shaped power supply bus bar (11) connected to the power supply pads of a semiconductor integrated circuit (2); an elongated flat sheet-shaped ground bus bar (12) connected to the ground pads of the semiconductor integrated circuit; a thin film insulator layer (13) formed between the power supply bus bar (11) and the ground bus bar (12); and an elongated flat sheet-shaped electrically conductive path portion (14) which includes a plurality of electrically conductive paths (15) connected to the signal pads of the semiconductor integrated circuit. The power supply bus bar (11), the ground bus bar (12), and the electrically conductive path portion (14) are respectively disposed in a parallel arrangement corresponding to a parallel arrangement of a power supply pad row, a ground pad row, and a signal pad row of the semiconductor integrated circuit, in an erected state such that the longitudinal direction of the thin plates are in parallel with respect to a bump mounting surface (2S) of the semiconductor integrated circuit.