PROCESS FOR CHEMICAL POLISHING OF SAPPHIRE FILAMENT WAFERS

摘要

Disclosed is a process for chemical polishing of sapphire filament wafers, comprising the following technological processes: a. cleaning and cutting into square pieces, and air-drying; b. alkaline high-temperature corrosion; c. cleaning; d. phosphoric acid corrosion; e. mixed acid chemical polishing; and f. cleaning. By using the chemical polishing process, the surface residual stress of the wafers can be effectively eliminated, the surface roughness of the wafers is reduced, and the production cost is greatly reduced.