BRIDGE RECTIFIER DEVICE HAVING ENHANCED HEAT DISSIPATION PERFORMANCE

摘要

A bridge rectifier device having enhanced heat dissipation performance comprises: first, second, third, and fourth diode chips (2, 3, 4, 5) covered by an epoxy molding compound, a first L-shaped connection piece (6), a second L-shaped connection piece (7), a first strip-shaped connection piece (8), and a second strip-shaped connection piece (9). The first and second diode chips are located at a support area of the first L-shaped connection piece. The third and fourth diode chips are located at a support area of the second L-shaped connection piece. The first strip-shaped connection piece is connected to the first and third diode chips, and the second strip-shaped connection piece is connected to the second and fourth diode chips. A positive input terminal (61), a negative input terminal (71), a first alternating current (AC) input terminal (81), and a second AC input terminal (91) are all exposed outside an outer surface of the epoxy molding compound. The epoxy molding compound comprises four recessed areas (10) located directly above the first, second, third, and fourth diode chips, respectively. The bridge rectifier device adopts a locally thinning design, preventing device deformation as well as reducing use of epoxy, locally thinning the device, and facilitating heat dissipation of the inside of the chip.