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PROCESS KIT DESIGN FOR IN-CHAMBER HEATER AND WAFER ROTATING MECHANISM

机译:箱内加热器和晶片旋转机构的过程套件设计

摘要

Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.
机译:本公开的实施例是与室内加热器和基板旋转机构一起使用的定向处理套件。在与本公开一致的一些实施例中,用于与可旋转的衬底支撑加热器基座一起用于在处理室中支撑衬底的处理套件可包括上边缘环,该上边缘环包括顶部壁架和从顶部壁架向下延伸的裙部,下边缘环,其至少部分地支撑上边缘环并且使上边缘环与衬底支撑加热器底座对准;设置在处理室的底部上的底板,当衬底支撑加热器底座为底部时,该底板支撑上边缘环。当基板支撑加热器基座处于升高的处理位置时,该阴影环与降低的非处理位置中的阴影环和上边缘环耦合。

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