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RESIN COMPOSITION, CURED PRODUCT, PATTERN CURED PRODUCT, CURED PRODUCT PRODUCTION METHOD, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM AND ELECTRONIC COMPONENT
RESIN COMPOSITION, CURED PRODUCT, PATTERN CURED PRODUCT, CURED PRODUCT PRODUCTION METHOD, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM AND ELECTRONIC COMPONENT
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机译：树脂成分，固化产品，图案固化产品，固化产品生产方法，绝缘膜夹层，表面保护膜和电子元件
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摘要
This resin composition contains: (a) a polyimide or polyimide precursor; (d1) a compound represented by formula (11) or (12); and (d2) one or more compounds selected from the group consisting of a compound represented by formula (13), a compound represented by formula (14), a compound represented by formula (15), and a compound represented by formula (16).
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