Manufacturing method of wireless antenna using hole making process skill of polymer layer sheet and wireless antenna circuit board wireless antenna module manufactured thereby electric-electronic device having wireless antenna module

摘要

The present invention relates to a method of manufacturing a circuit board for a wireless antenna by using hole processing technology for a conductive polymer sheet, a circuit board for a wireless antenna manufactured by the same, a wireless antenna module, and an electric and electronic device. To form a circuit board for a wireless antenna, a material for a conductive polymer layer before the lamination of a both-sided copper foil lamination plate (FCCL) is cut into a sheet and thermally cured at no less than Tg temperature, and then, a through hole is formed in a larger size than a via hole, which is processed in a succeeding process, in accordance with predetermined via hole coordinates, and then, an inner insulation sheet is laminated between the upper and lower copper foils, and then, in the succeeding process, the via hole is formed in a smaller size than the through hole in accordance with centric coordinates of the through hole. At this point, the sheet is thermally transformed by a hot press to make the upper and lower foil close to its insulating layer in a space of the through hole of the polymer layer, and then, the via hole goes through a plating process. Thus, the present invention is capable of forming via patterns by securing insulation for the conductive polymer layer at a low cost and with a relatively easy process, and especially, preventing the deformation of a polymer hole, bubbles on copper foil patterns, and bird-caging or biting during the operation of a hot press better than the use of an existing incompletely cured conductive polymer layer.