Method and device for estimating damage level or lifetime prediction of a power semiconductor module

摘要

The present invention relates to a method and a device for estimating the damage level or lifetime prediction of a power semiconductor module comprising at least one die mechanically, thermally, and electrically attached to a substrate composed of a plurality of layers of different materials. The present invention relates to a power semiconductor module, comprising: a power semiconductor module; a power semiconductor module; a power semiconductor module; a plurality of power semiconductor modules; Judges whether or not a notification indicating a damage level or a life prediction should be performed in accordance with the estimated thermal model and the reference thermal model, Notify the damage location or life prediction.