METHOD FOR MONITORING BLADE STRAIN MONITORING DEVICE OF ATM ROBOT FOR WAFER TRANSFER

摘要

The present invention relates to a method for monitoring a blade strain monitoring device of an atmosphere (ATM) robot that loads and unloads a wafer to or from an equipment front end module (EFEM) installation, the method comprising the steps of: irradiating light from a light source by a sensor to form at least one mark which is shown as a reflective light on the blade; measuring first image coordinates of the position of the mark formed on the blade by a measuring unit at initial operation of the blade to generate a position reference point, and measuring second image coordinates of the position of the mark formed on the blade after the initial operation of the blade; calculating an error occurring between the first image coordinates and the second image coordinates by a calculating unit on the basis of coordinate data of the position of the mark; and comparing the error occurring between the coordinate data and a predetermined allowable strain range of the blade by an evaluation unit to determine the strain. Since the blade strain of the ATM robot is detected by the sensor provided to the EFEM installation, the strain generated from the blade of the ATM robot is monitored in real time, thereby effectively handling the wafer by the ATM robot.;COPYRIGHT KIPO 2018