A silicone composition comprising a combination of a condensation curing reaction and an organic peroxide curing reaction

摘要

It is possible to suppress the deterioration of the cured product due to the change in hardness at the time of heat resistance or during a cooling / heating cycle, cracks or deviations, and the like, A thermally conductive silicone composition is provided. In the conventional condensation-curable silicone composition, organic peroxide curing by organic peroxide is used at the time of curing.