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Curing reaction and kinetic parameters of diallyl orthophthalate resin with initiator dicumyl peroxide

机译:用引发剂二甲基过氧化物的二烯丙基邻苯二甲酸酯树脂的固化反应和动力学参数

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The curing reaction of diallyl orthophthalate(DAOP) resin, which was initiated by dicumyl peroxide(DCP), was studied by Fourier transform infrared spectroscopy(FTlR). Differential scanning calorimetry(DSC) was used to determine the curing behavior and kinetic parameters of dicumyl peroxide (DCP) / diallyl orthophthalate (DAOP) system. The results clarified that the curing reaction of DAOP resin could be initiated by DCP at 150-180°C and the reaction heat diffused slowly in curing process. The gel-temperature, curing temperature and thermal treatment temperature of the DCP(3%)/DAOP system were 145.46°C, 166.03°C and 173.83°C. The apparent activation energy, frequency factor and reaction order were 130.200kJ/mol, 5.231× 10~(10) and 0.9455, respectively.
机译:通过傅里叶变换红外光谱(FTLR)研究了由二甲基过氧化物(DCP)引发的二烯丙基邻苯二甲酸酯(DAOP)树脂的固化反应。使用差分扫描量热法(DSC)来确定二亚砜(DCP)/二烯丙基邻苯二甲酸二甲酸酯(DAOP)系统的固化行为和动力学参数。结果阐明了DCP可以在150-180℃下通过DCP引发的固化反应,并在固化过程中缓慢扩散反应热量。 DCP(3%)/ DAOP系统的凝胶温度,固化温度和热处理温度为145.46℃,166.03°C和173.83°C。表观活化能量,频率因数和反应顺序分别为130.200kJ / mol,5.231×10〜(10)和0.9455。

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