Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction

摘要

Provided is a thermally conductive silicone composition which need not be stored with cooling or freezing and needs neither a heating nor a cooling step during mounting to bring about a high production efficiency and which gives cured objects that, during heating or cold/heat cycling, can be inhibited from suffering a change in hardness or a deterioration caused by cracking or dislocation. The composition includes a conventional condensation-curable silicone composition, and is cured by a combination of the condensation and curing with an organic peroxide.