3D IC3DIC --SOCCOMPLETE SYSTEM-ON-CHIP SOC USING MONOLITHIC THREE DIMENSIONAL 3D INTEGRATED CIRCUIT IC 3DIC TECHNOLOGY

摘要

The embodiments disclosed in the detailed description include a complete system-on-a-chip (SOC) solution using monolithic three-dimensional (3D) integrated circuit (3D) integration technology. The present disclosure provides a method and system for implementing the method of the present invention in order to create a system on a chip that includes layers within a monolithic 3DIC and a possible subsequent short between tiers passing through monolithic intertier via (MIV) Includes examples of the ability to customize interconnection. In particular, different tiers of the 3DIC are configured to support different functions and adhere to different design criteria. Thus, 3DIC may have analog layers, layers with higher voltage thresholds, layers with lower leakage current, layers of different materials to implement components that require different base materials, and the like. Unlike stacked dies, the top layers can be the same size as the bottom layers, since no external wiring connections are required.