Method of manufacturing anisotropic conductive adhesive comprising gaper and method of mounting components using the gaper

摘要

The present invention relates to a method for manufacturing an anisotropic conductive adhesive comprising a gapper and to a method for mounting components using the anisotropic conductive adhesive, and provides the method for manufacturing the anisotropic conductive adhesive, which comprises the following steps: removing a first oxide film of solder particles with a first reducing agent; and mixing the solder particles, the gapper, and an adhesive resin to manufacture the anisotropic conductive adhesive. An object of the present invention is to prevent molten solder and the adhesive resin from leaking between upper and lower substrates by the gapper, and to prevent the molten solder constituting solder bumps from flowing out from upper and lower terminals.