EWT MANUFACTURING METHOD OF SILICON THIN FILM FOR EMITTER WRAP-THROUGH SOLAR CELL SUBSTRATE

摘要

It is an object of the present invention to obtain a silicon thin film for an EWT solar cell substrate, in particular a porous silicon thin film formed up to a PN junction, by a simple process. To this end, the present invention provides a method of manufacturing a semiconductor device, comprising: forming a plurality of holes in a silicon base material; Depositing a stress layer on the surface of the silicon base material; And a step of peeling the stress layer and the surface layer of the silicon base material as a thin film by stress of the stress layer.