A UV LED package is disclosed. The UV LED package comprises: a first depression; A second depression having one side corresponding to one side of the first depression; An insulating material formed between one side of the first depression and the corresponding side of the second depression; A protective member formed to have a predetermined height above the first depressed portion and the second depressed portion; A first reflective electrode film formed on an upper surface of the radiator plate and a second reflective electrode film spaced apart from the first reflective electrode film with an electrode separation gap therebetween, A submount; And a UV LED chip of 200 nm to 400 nm flip-chip bonded on the first reflective electrode film and the second reflective electrode film of the submount, wherein the submount is formed of a quadrangle having four corners, The second reflective electrode film is formed to have at least one corner, and the first reflective electrode film is formed to have at least two or more corners.
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