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Method for restoring coating layer of semiconductor process equipment component and semiconductor process equipment component thereof

机译:还原半导体工艺设备部件的涂层的方法及其半导体工艺设备部件

摘要

In the present invention, there is provided a method for regenerating parts of a semiconductor process equipment, which can reduce material and cost by removing only contaminants accumulating in semiconductor process equipment parts and a part of the upper part of the coating layer and preserving the undamaged coating layer, Equipment components are disclosed.As an example, a base material; A coating layer formed to cover a surface of the base material; And a step of preparing a process equipment part including a contaminated layer stacked on a coating layer; A preservation layer preserving step of removing only the contaminant layer and a part of the coating layer under the contaminant layer to preserve the preservation layer; And a restoration layer forming step of forming a restoration layer on the storage layer.
机译:在本发明中,提供了一种用于再生半导体处理设备的部件的方法,该方法可以通过仅去除积聚在半导体处理设备的部件和涂层的上部的一部分中的污染物并保留未损坏的部件来减少材料和成本。涂层,公开了设备组件。形成为覆盖基材表面的涂层;以及制备包括堆叠在涂层上的污染层的处理设备部件的步骤;保存层保存步骤,仅去除污染物层和污染物层下面的一部分涂层以保存保存层;以及恢复层形成步骤,其在存储层上形成恢复层。

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