A new type of automatic semiconductor material grinding equipment

• 1. 一种新型全自动半导体材料研磨设备 [P] . 中国专利： CN208810226U . 2019.05.03
• 2. 一种新型全自动半导体材料研磨设备 [P] . 中国专利： CN108032210A . 2018-05-15
• 3. Preparation manner of chemical machine grinding service water type dispersing element, and the said dispersing element, and chemical machine grinding manner of semiconductor equipment [P] . 日本专利： JP5344136B2 . 2013-11-20

  机译： 化学机械研磨用水型分散元件的制备方式，以及所述分散元件以及半导体设备的化学机械研磨方式

• 4. Chemical machine grinding service water type dispersing element and chemical machine grinding manner of semiconductor equipment [P] . 日本专利： JP4143872B2 . 2008-09-03

  机译： 半导体设备的化学机械研磨服务水型分散元件和化学机械研磨方式

• 5. MATERIAL ROTATION-TYPE SILICONE FILAMENT AUTOMATIC GRINDING MACHINE AND GRINDING SYSTEM USING SAME [P] . 世界知识产权组织专利： WO2019093642A1 . 2019-05-16

  机译： 旋转式硅纤维长丝自动磨床及其磨削系统

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