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Chemical machine grinding service water type dispersing element and chemical machine grinding manner of semiconductor equipment
Chemical machine grinding service water type dispersing element and chemical machine grinding manner of semiconductor equipment
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机译:半导体设备的化学机械研磨服务水型分散元件和化学机械研磨方式
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摘要
A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a heterocyclic ring in its molecule, (B) a second water-soluble polymer or its salt having a weight average molecular weight of 1000 to 10,000 and including one group selected from a carboxyl group and a sulfonic group, (C) an oxidizing agent and (D) abrasive grains and has a pH of 7 to 12.
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