首页> 外国专利> SILICON NITRIDE BOARD, METHOD FOR MANUFACTURING THE SILICON NITRIDE BOARD, AND SILICON NITRIDE CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THE SILICON NITRIDE BOARD

SILICON NITRIDE BOARD, METHOD FOR MANUFACTURING THE SILICON NITRIDE BOARD, AND SILICON NITRIDE CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THE SILICON NITRIDE BOARD

机译:硅氮化物板,制造硅氮化物板的方法以及使用硅氮化物板的硅氮化物电路板和半导体模块

摘要

Provided are a silicon nitride substrate made of a silicon nitride sintered body that is high in strength and thermal conductivity, a method of producing the silicon nitride substrate, and a silicon nitride circuit substrate and a semiconductor module that use the silicon nitride substrate. According to the silicon nitride sintered body, in a silicon nitride substrate consisting of crystal grains 11 of ²-type silicon nitride and a grain boundary phase containing at least one type of rare earth element (RE), magnesium (Mg) and silicon (Si), the grain boundary phase consists of an amorphous phase 12 and a MgSiN 2 crystal phase 13; the X-ray diffraction peak intensity of any crystal plane of a crystal phase containing the rare earth element (RE) is less than 0.0005 times the sum of the diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the ²-type silicon nitride; and the X-ray diffraction peak intensity of (121) of the MgSiN 2 crystal phase 13 is 0.0005 to 0.003 times the sum of the X-ray diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the ²-type silicon nitride.
机译:提供由强度和热导率高的氮化硅烧结体制成的氮化硅基板,该氮化硅基板的制造方法,以及使用该氮化硅基板的氮化硅电路基板和半导体模块。根据该氮化硅烧结体,在由β型氮化硅的晶粒11和包含至少一种稀土元素(RE),镁(Mg)和硅(Si ),晶界相由非晶相12和MgSiN 2晶相13组成;包含稀土元素(RE)的晶相的任何晶面的X射线衍射峰强度小于(110),(200),(101),(210)的衍射峰强度总和的0.0005倍2型氮化硅的晶粒),(201),(310),(320)和(002)。 MgSiN 2晶相13的(121)的X射线衍射峰强度是(110),(200),(101),(210)的X射线衍射峰强度的和的0.0005〜0.003倍。 ,(201),(310),(320)和(002)是2型氮化硅的晶粒。

著录项

  • 公开/公告号EP2301906B1

    专利类型

  • 公开/公告日2019-10-23

    原文格式PDF

  • 申请/专利权人 HITACHI METALS LTD.;

    申请/专利号EP20090773579

  • 发明设计人 KAGA YOUICHIROU;WATANABE JUNICHI;

    申请日2009-07-03

  • 分类号C04B35/584;H01L23/12;H01L23/13;H01L23/15;H05K1/03;

  • 国家 EP

  • 入库时间 2022-08-21 12:31:11

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