A bubble-jetting chip capable of jetting bubbles upward from a substrate is provided. Bubbles can be jetted upward from a substrate by a bubble-jetting chip comprising: at least a substrate, an energizing portion, and a bubble-jetting portion; the energizing portion being formed on the substrate; the bubble-jetting portion comprising an electrode that is formed of a conductive material, a shell part formed of an insulating photosensitive resin, and an extended section that extends from the shell part, the shell part covering a periphery of the electrode, the extended section extending beyond a tip of the electrode, and the bubble-jetting portion further comprising a space formed between the extended section and the electrode; and the electrode of the bubble-jetting portion being formed on the energizing portion.
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