EMBEDDING A COMPONENT INTO A COMPONENT CARRIER BY TRANSFERRING THE COMPONENT INTO A CAVITY BEING ALREADY FILLED WITH FILLING MATERIAL

摘要

Described is a method for manufacturing a component carrier (160) having an embedded component (120). The method comprises providing a support structure (100); attaching an electronic component (120) at a surface of the support structure (100); providing a core structure (130); forming a cavity (130a) within the core structure (130); partially filling the cavity (130a) with a predefined amount of filling material (140); positioning the support structure (100) relative to the core structure (130) in such a manner that the electronic component (120) is transferred into the cavity (130a) and is dipped into the filling material (140); curing the filling material (140) such that the component (120) within the cavity (130a) is fixed to core structure (130); and removing the support structure (100).