首页> 外国专利> Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure

Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure

机译:通过预先形成的电连接结构将已知合格组件嵌入已知合格组件载体材料的已知合格腔中

摘要

A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity.
机译:一种制造部件载体的方法,包括:提供包括已经形成的导电连接结构和已知良好的腔的已知良好的层堆叠,以及将已知良好的部件安装在腔中已经形成的导电连接结构上。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号