EMBEDDING KNOWN-GOOD COMPONENT IN KNOWN-GOOD CAVITY OF KNOWN-GOOD COMPONENT CARRIER MATERIAL WITH PRE-FORMED ELECTRIC CONNECTION STRUCTURE

摘要

A method of manufacturing a component carrier (100), wherein the method comprises providing a known-good layer stack (102) comprising an already formed electrically conductive connection structure (104) and a known-good cavity (106), and mounting a known-good component (108) on the already formed electrically conductive connection structure (104) in the cavity (106).