首页> 外国专利> LOCAL HEATING DEVICE OF SUBSTRATE, CONTROL DEVICE OF EDGE FILM THICKNESS OF FLUID OF SUBSTRATE TO WHICH FLUID IS APPLIED, COATING DEVICE OF FLUID, DRYING DEVICE OF FLUID APPLIED ON SUBSTRATE, AND CONTROL METHOD OF EDGE THICKNESS OF FLUID

LOCAL HEATING DEVICE OF SUBSTRATE, CONTROL DEVICE OF EDGE FILM THICKNESS OF FLUID OF SUBSTRATE TO WHICH FLUID IS APPLIED, COATING DEVICE OF FLUID, DRYING DEVICE OF FLUID APPLIED ON SUBSTRATE, AND CONTROL METHOD OF EDGE THICKNESS OF FLUID

机译:基板的局部加热装置,基板的流体的边缘膜厚度的控制装置,所涂敷的基板的流体,基板的涂敷装置,基板的流体的干燥装置,基板的边缘厚度的控制方法

摘要

To reduce the thickening of the end of a fluid applied to a substrate and improve the productivity.SOLUTION: In a fluid-applied substrate, the end portion of a fluid of the fluid-applied substrate is heated to a predetermined temperature by means of heating to a temperature higher than the surrounding.SELECTED DRAWING: Figure 1
机译:为了减少施加到基板上的流体末端的增稠并提高生产率。解决方案:在施加流体的基板中,通过加热将施加流体的基板的流体的末端部分加热到预定温度。温度高于周围环境。选定的图:图1

著录项

  • 公开/公告号JP2019114378A

    专利类型

  • 公开/公告日2019-07-11

    原文格式PDF

  • 申请/专利权人 TORAY IND INC;

    申请/专利号JP20170245911

  • 发明设计人 SAKASHITA RYUTA;TANI YOSHINORI;

    申请日2017-12-22

  • 分类号H05B3;B05C9/14;B05C5/02;B05C11/10;B05D3;B05D3/02;H01L21/027;F26B3/353;

  • 国家 JP

  • 入库时间 2022-08-21 12:25:15

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