FLAME-RETARDANT ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, ELECTRIC OR ELECTRONIC COMPONENT, AND METHOD FOR IMPROVING HEAT-RESISTANT ADHESIVENESS OF ELECTRIC OR ELECTRONIC COMPONENT

摘要

To provide a flame-retardant room temperature-curable organopolysiloxane composition that prevents air bubbles from occurring from a cured product even when exposed to high temperature and has, therefore, high reliability; also prevents its curability from deteriorating with time and has excellent storage stability.SOLUTION: A flame-retardant room temperature-curable organopolysiloxane composition contains (A) diorganopolysiloxane with both terminals of a molecular chain sealed with a hydroxy group and/or hydrolyzable siloxy group bound to a silicon atom, (B) magnesium hydroxide with an average particle size of 0.4-5 μm, (C) a curing catalyst, (D) a hydrolyzable organosilicon compound and/or a partial hydrolytic condensate thereof represented by formula (1): RSi(OR)(Ris a substituted monovalent hydrocarbon group containing N, S and O, Ris an ethyl group, a is 1 or 2), and (E) a hydrolyzable organosilicon compound and/or a partial hydrolytic condensate thereof represented by formula (2): RSi(OR)(Ris an unsubstituted or halogen-substituted monovalent hydrocarbon group, Ris a methyl group, b is 0,1 or 2).SELECTED DRAWING: None